3D Circuit Architect

Our customer from the Leuven region is an important Telecom player. We are looking for a 3D Image Sensor Chip Architect.

Function

  • Develop a 3D image senor chip
  • Decompose the chip system design specifications
  • Perform corresponding design constraints on each readout module
  • Coordinate the pixel design team to complete the circuit design and backend implementation
  • Propose related key technologies of circuits to improve the core competitiveness of the chip

Profile

  • Master/Phd
  • 5 years of experience in the area
  • Many experience in mass production of image sensor chip products, solves design or engineering problems in the process from sample to mass production.

Offer

In addition to a contract with an attractive salary, we offer you:

  • an exciting employer in full expansion that offers many future opportunities for your further career in the technical sector;
  • a lot of extra-legal benefits that fit your contract type and your own preferences (such as a company car / bicycle, group insurance, daily allowance);
  • TEC Plaza's (better known as afterwork or network drinks) that you should not miss; company events in a real TEC atmosphere. Just think of the annual BBQ, sports events (Ten Miles), an end-of-year dinner, a family day (film day), etc.
  • the ability to further develop your own talent thanks to our Competence Center (expert classes where one guest speaker will tell about a technical topic) and thanks to our online Cevora training courses (for both your soft and hard skills);
  • personal contact with and support of our close team of office managers, account managers and recruiters;
  • a personal gift on special occasions (birthday, anniversary, ...);
  • occasional treats at the yard or customer site;
  • and last but not least: the chance to build up a large network and to share your experiences and knowledge with other technical profiles.


Get in touch

Katia Jornik +32477961360

Details

Telecom
ICT
Management (Manager/Leidinggevende)
VLAAMS BRABANT (LEUVEN)
2019-09-27

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